About

PIE is short for Paper International Experience.  This program allows engineering scholars to develop as well-rounded professionals ready to make significant contributions to industry, their community and their world!

This is a 10-14 day biennial trip for junior and senior paper science and engineering students.  In 2007 we traveled to China; 2009 Chile, 2011 Brazil, 2013 China. 2015 Finland and this time we are headed BACK TO CHINA!

Participants become more aware of the global community and experience thing they never had before.  They understand their own pulp and paper industry better, in the context of the global market.  They are better thinkers . . . better learners . . .and better engineers for having participated in this experience!