Paper International Experience
About
The Paper International Experience (PIE) program gives junior and senior engineering students the opportunity to develop as well-rounded professionals ready to make significant contributions to industry, their communities, and the world. PIE is a 10 to 14 day biennial trip for paper science and engineering students.
Participants gain a greater awareness of the global community and unique industry insights. They develop a deeper understanding of the U.S. pulp and paper industry within the global market context. They emerge as better thinkers, better learners, and better engineers through this experience.
Upcoming Trip
In 2025, we’re going to Brazil! More information will be posted soon.
Fundraising
Students take part in fundraising efforts to help cover their travel expenses. Typically, they raise enough to cover two-thirds of the trip’s cost by the Jan. 31, 2025 deadline. We invite anyone interested in helping them reach their goal to make a gift.
Past Trips
- China (2007)
- Chile (2009)
- Brazil (2011)
- China (2013)
- Finland (2015)
- China (2017)
- Spain (2019)
- Finland (2023)